发明名称 COATING COMPOSITION FOR POSITIVE TYPE PHOTORESIST AND POSITIVE TYPE RESIST PATTERN FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To obtain a coating compsn. for a positive type photoresist depositing no photosensitive component, excellent in solubility, properties of a coating film and shelf stability and capable of forming a resist pattern having a good sectional shape. SOLUTION: An alkali-soluble resin and a quinonediazido group-contg. compd. are dissolved in a carbonic ester-contg. org. solvent to obtain the objective coating compsn. for a positive type photoresist. The carbonic ester is, e.g. dimethyl carbonate or diethyl carbonate. The coating compsn. is applied on a substrate to form a photosensitive layer, this photosensitive layer is irradiated in accordance with a pattern to be formed and the irradiated layer is developed with an alkali developer to form the objective positive type resist pattern.
申请公布号 JPH11202479(A) 申请公布日期 1999.07.30
申请号 JP19980057414 申请日期 1998.01.14
申请人 DAICEL CHEM IND LTD 发明人 MAEDA SHIGEHIRO
分类号 G03F7/023;G03F7/00;H01L21/027;(IPC1-7):G03F7/00 主分类号 G03F7/023
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