MANUFACTURE OF ADHESIVE-COATED FLEXIBLE PRINTED-CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a high thermal resistant adhesive-coated flexible printed-circuit board having no curl at all. SOLUTION: A polyamidic acid film 2 is formed from polyamidic acid solution of polyimide resin having a smaller linear expansion coefficient than that of copper to be annealed at a high temperature after thermocompression bonding with a copper foil 3, so that the polyamidic acid may be turned into ring-closed imide to form the copper foil 3 with polyimide enabling the adhesive-coated flexible printed-circuit board to be manufactured by fluidly coating and drying an adhesive resin solution on this polyimide layer.