发明名称 |
Semiconductor apparatus and method for fabricating the same |
摘要 |
A semiconductor apparatus includes a semiconductor chip and a die pad on which the semiconductor chip is mounted. The die pad is provided thereon with an opening. The semiconductor chip and the die pad may be shaped to be similar figures of rectangle, and the opening may include a plurality of first slits which are arranged around the corners of the die pad, respectively.
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申请公布号 |
US5986333(A) |
申请公布日期 |
1999.11.16 |
申请号 |
US19970916445 |
申请日期 |
1997.08.22 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
NAKAMURA, AKIO |
分类号 |
H01L23/50;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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