发明名称 |
Thin film capacitor coupons for memory modules and multi-chip modules |
摘要 |
A semiconductor device including a thin capacitor coupon mounted to the backside of a semiconductor die. When mounted active surface up on a carrier substrate of a multi-chip module, the coupon is secured between the backside of the die and the substrate. When flip-chip connections or direct chip attach are employed between the die and substrate, the coupon is secured to the backside of the die. The coupons may be preformed, or formed on the die in a wafer-scale fabrication process prior to singulation of the dice.
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申请公布号 |
US6165814(A) |
申请公布日期 |
2000.12.26 |
申请号 |
US19990337783 |
申请日期 |
1999.06.22 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
WARK, JAMES M.;AKRAM, SALMAN |
分类号 |
H01L21/98;H01L23/50;H01L23/64;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/98 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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