发明名称 |
Package for housing semiconductor chip, and semiconductor device |
摘要 |
The present invention provides a semiconductor package allowing a semiconductor chip to be operated accurately and with high stability over a long period by effectively transferring the heat generated during the operation of the semiconductor chip to a heat sink. A package for housing a semiconductor chip comprises a substrate 2 having on the upper surface thereof a mounting space where a semiconductor chip 1 is to be mounted, a frame 3 being provided so as to surround the mounting space on the upper surface of the substrate 2 and having a joint 3a for an input/output terminal 5 on the side, and an input/output terminal 5 connected to the joint 3a, wherein the substrate 2, or part of the substrate 2, or the substrate 2 and the frame 3, or part of the substrate and the frame is formed from a metal-diamond composite in which a matrix material having diamond particles joined via a metal carbide is infiltrated with a copper and/or silver or a metal-diamond sintered body composed of diamond particles and copper. Further, the surface of the metal-diamond composite is plated with gold.
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申请公布号 |
US2004183172(A1) |
申请公布日期 |
2004.09.23 |
申请号 |
US20030679351 |
申请日期 |
2003.10.07 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
SAITO HIROHISA;TSUNO TAKASHI;KAWAI CHIHIRO;TANAKA MOTOYOSHI |
分类号 |
H01L23/14;H01L23/057;H01L23/06;H01L23/28;H01L23/373;H01L23/38;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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