发明名称 RESIN MOLDING METHOD AND RESIN MOLDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a resin molding method capable of selectively heating the thermoplastic resin in a cavity with respect to a mold made of a rubber to obtain a good resin molded product, and a resin molding apparatus. SOLUTION: The resin molding apparatus 1 has the mold 2 made of the rubber having a cavity 21 formed thereto, a vacuum means 61 for bringing the inside of the cavity 21 to a vacuum state and an electromagnetic wave generating means 4 for emitting an electromagnetic wave (near infrared rays) with a wavelength of 0.78-2μm is used and constituted so as to perform a vacuum process for bringing the inside of the cavity 21 of the mold 2 made of the rubber to a vacuum state, a filling process for filling the cavity 21 of the vacuum state with the thermoplastic resin 3 of a molten state and a cooling process for cooling the thermoplastic resin 3 in the cavity 21 to obtain the resin molded product. In the filling process, the thermoplastic resin 3 is irradiated with near infrared rays through the mold 2 to selectively heat the thermoplastic resin 3 with respect to the mold 2. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007216447(A) 申请公布日期 2007.08.30
申请号 JP20060037675 申请日期 2006.02.15
申请人 TECHNO POLYMER CO LTD;NIPPON REKKUSU KK;USHIO INC 发明人 KURIHARA FUMIO;TAKAMI MASAMITSU;ISO SHINICHI
分类号 B29C33/38;B29C39/02;B29C39/24;B29C39/38;B29K101/12 主分类号 B29C33/38
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