发明名称 Thermal interface materials and systems and devices containing the same
摘要 This disclosure relates generally to thermally conductive polymer composites and particularly to thermal interface materials.
申请公布号 US9346991(B2) 申请公布日期 2016.05.24
申请号 US201213448257 申请日期 2012.04.16
申请人 ADA Technologies, Inc. 发明人 Arzberger Steven C.;Naha Sayangdev;Campbell Douglas
分类号 H01B1/02;H01B1/04;C09K5/14;B82Y30/00 主分类号 H01B1/02
代理机构 Sheridan Ross P.C. 代理人 Sheridan Ross P.C.
主权项 1. A composition, comprising: a conductive, percolated network having elongated, thermally conductive particles distributed throughout a matrix material, wherein the elongated, thermally conductive particles comprise no more than 20 volume % of the composition, wherein the matrix material comprises at least about 80 volume % of the composition, wherein the elongated, thermally conductive particles are selected from the group consisting essentially of metallic nano-wires, metallic alloy nano-wires, metallic carbon nano-tubes, coated-elongated particles, and combinations and/or mixtures thereof, wherein the elongated thermally conductive particles comprise a coating having an electron-phonon coupling length of no more than about 1×10−2 cm, wherein the coated-elongated particles are selected from the group consisting essentially of coated carbon nano-tubes, coated graphene sheets, coated-elongated graphite particles and mixtures thereof, and wherein the coated-elongated particles are coated with a coating material containing one or more of Ge, Si, Ga, As, In, Sb, Bi, Te, Cd, S, Se, Hg, P, Pb, Sn, Cu, Ag, Au, binary combinations in any atomic ratio thereof, tertiary combinations in any atomic ratio thereof, and other combinations thereof.
地址 Littleton CO US