Integrated circuit chip comprising electronic device and electronic system

摘要

An electronic device includes a substrate wafer made of an insulating material and having an electrical connection network. An integrated circuit chip is mounted to a top side of the substrate wafer. The substrate wafer contains an internal duct. The duct is formed by a covered trench located in the top side of the substrate wafer. The trench contains a thermally conductive material, for example being a fluid. Openings in the top side of the substrate wafer that are offset from the trench permit the making of an electrical connection between the integrated circuit and the electrical connection network.

主权项

1. An electronic device, comprising:
a substrate wafer made of an insulating material and including an electrical connection network; wherein the electrical connection network comprises a metal level on a plane including electrical connection pads; an integrated circuit chip mounted on a top side of the substrate wafer; and wherein the substrate wafer comprises at least one internal duct formed in the substrate wafer by a groove which is covered by a superficial layer; and an intermediate layer on said plane and which is covered by said superficial layer; wherein said groove is formed in the intermediate layer, the intermediate layer and said superficial layer containing apertures above electrical connection pads, and said groove separated by a distance from said apertures; and wherein a depth of said groove is smaller than a depth of the intermediate layer.