发明名称 |
Production of an Optoelectronic Component |
摘要 |
A method for producing an optoelectronic component is disclosed. In various embodiments, the method includes arranging a plurality of optoelectronic semiconductor chips on a carrier and commonly compressing separate molding compounds in areas of the optoelectronic semiconductor chips, wherein separate molded bodies are formed in the areas of the optoelectronic semiconductor chips. |
申请公布号 |
US2016233200(A1) |
申请公布日期 |
2016.08.11 |
申请号 |
US201415025759 |
申请日期 |
2014.10.15 |
申请人 |
OSRAM Opto Semiconductors GmbH |
发明人 |
Pindl Markus;Jerebic Simon;Geltl Tobias |
分类号 |
H01L25/075;H01L33/62;H01L33/50;H01L33/60;H01L21/66;H01L33/54 |
主分类号 |
H01L25/075 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Regensburg DE |