首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
SOLID BUFFING COMPOUND
摘要
申请公布号
JPH06340824(A)
申请公布日期
1994.12.13
申请号
JP19930226448
申请日期
1993.08.18
申请人
TABATA TOSHIKAZU
发明人
TABATA TOSHIKAZU
分类号
C09C1/68;B24D3/20;C09C3/08;C09K3/14;(IPC1-7):C09C1/68
主分类号
C09C1/68
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Packet flooding defense system
High frequency transformer with integrated rectifiers
Method and apparatus for providing a view of an electronic mail message
Phytyl/prenyltransferase nucleic acids, polypeptides and uses thereof
Sorting a group of integrated circuit devices for those devices requiring special testing
Ultrasound imaging system and method using weighted chirp signals
Hydrothermal treatment of nanostructured films
Fiber optic module connector cleaning slide
Knit wear with collar knit by flat knitting machine and method of knitting it
Exercise apparatus for simulating skating movement
Method, system, and apparatus to improve performance of multi-threaded computer programs
Ultra-broadband antenna incorporated into a garment with radiation absorber material to mitigate radiation hazard
Battery charger, including an amplifier for audio signals, for portable audio devices
Erasure based instantaneous loop control in a data receiver
Self-locating connector
Game machine, game processing method and information storage medium
Side bar for flat panel display device, manufacturing method thereof, and flat panel display device having side bar
Glyceryl nucleotides, method for the production thereof and their use
Schottky structure in GaAs semiconductor device
Semiconductor device and methods of fabricating the same