| 摘要 |
PURPOSE: To provide a gas distribution plate which can introduce gas sufficient for a plasma processing into a chamber, has openings which are not blocked and can suppress arcing despite of the type of plasma generated in the chamber. CONSTITUTION: The gas distribution plate 10 used for the semiconductor wafer process chamber has non-circular openings 14 which are formed for making gas pass through and are arranged in symmetrical patters. The length of the short shafts of the non-circular openings are at least longer than about 127μm (5 mils), about 254μm, most suitably, and shorter than about 762μm (30 mils), about 635μm (25 mils), most stability. The lengths of the long shafts are longer than the short shafts and they are longer than about 635μm (25 mils), most suitably. The most suitable lengths are about 762μm (30 mils). It is desirable that at least several walls of the non-circular openings are not vertical against the face of the gas distribution plate.
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