| 摘要 |
PURPOSE: To improve the electric connection of resin molded inner leads to a semiconductor chip through bonding wires by forming openings through the inner leads. CONSTITUTION: The electric connection of a semiconductor chip 1 to inner leads 2a is made through openings 8 formed at central parts of the leads. Pads 6 are formed below the openings 2 and bonding wires 3 are formed, extending from the pads 6 to the surfaces of the leads 2a, thus connecting the wires 3 to the surfaces of the leads 2a through the openings 8. There is no need of purposely connecting the wires 3 to the surfaces of the leads 2a, so far as connected to the side faces of the openings 8. Thus, the wires 3 can be housed in the openings 8, this allowing the wires 3 to be very short.
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