发明名称 Thermal type infrared imaging device and fabrication method thereof
摘要 A fabrication method of a thermal type infrared ray imaging device that includes forming a plurality of diodes in a single crystal silicon layer as first and second thermoelectric conversion parts constituting a thermoelectric conversion part; forming input and output wirings to be connected to a plurality of cells; forming a plurality of opening portions which expose the single crystal silicon substrate; forming a first photothermal conversion layer; and removing selectively a portion of the single crystal silicon substrate via the plurality of opening portions.
申请公布号 US7067810(B2) 申请公布日期 2006.06.27
申请号 US20030393259 申请日期 2003.03.21
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 SHIGENAKA KEITARO;MASHIO NAOYA
分类号 G01J1/02;H01L25/00;H01L27/14;H01L27/146;H01L31/028;H04N5/33;H04N5/335;H04N5/369 主分类号 G01J1/02
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