| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size, thickness and weight of an electronic circuit in a portable apparatus by bonding a metal foil or a metal plate to the surface part of sealing resin of a semiconductor device. SOLUTION: An IC chip 2 is mounted on a lead frame 1 and bonded thereto and then each I/O terminal of the IC chip is connected with a corresponding terminal part of the lead frame 1 through a gold wire 4 and resin sealed. A metal foil or a metal plate 5 of aluminum, iron-nickel allay or copper allay of 0.01-0.3 mm thick is then bonded to the upper and lower surfaces of a sealing resin 3 through an adhesive. Since electromagnetic noise generated from the IC chip 2 being driven with a high frequency clock can be shielded by the metal foil or the metal plate 5, leakage of the electromagnetic noise to the outside can be prevented or reduced significantly. According to the arrangement, the size, thickness and weight of an electronic circuit in a portable apparatus can be reduced. |
