| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the reliability of connection during mounting a semiconductor device, and to facilitate process control, in a manufacturing process of the semiconductor device. <P>SOLUTION: The semiconductor device comprises a tab 1e for supporting a semiconductor chip 2, a sealed body 3 that is formed by sealing the semiconductor chip 2 with resin, a plurality of leads 1a that are made of copper alloys exposed to the rear surface 3a of the sealed body 3, and have exposed mounting surfaces 1d on which solder-plating layers 8 are formed, and wires 4 for connection pads 2a of the semiconductor chips 2 and leads 1a corresponding to the pads 2a. In the manufacturing process, after molding the sealed body 3 with resin by polishing its rear surface 3a using a brush, both edges of the lead 1a in the width direction exposed from the rear surface 3a of the sealed body 3 are made curved surfaces, and the central part of the mounting surface 1d of the lead 1a including the curved surfaces is made to extrude from the rear surface 3a of the sealed body 3, thereby resulting in the improvement of the reliability of connection during mounting. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
