| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a semiconductor package having improved reliability in substrate mounting and generating no metal burrs on the tip part of a lead part, even after cutting of a lead. SOLUTION: Chip cutting of a lead part 28 is performed, using a dicer 30 for the purpose of separating the lead part 28 and the lead frame 29 a semiconductor package 27, which is formed in the state wherein sheet 2 is adhered to the lead frame 29, and the lead is cut in the state wherein its tip parts are brought parallel with each other. Accordingly, since the package is cut by a dicer in a state wherein the sheet 21 is adhered, metal burrs are not generated on the lead tip, no touble is produced in the formation of a solder fillet when a substrate is mounted, and the reliability of substrate mounting can be improved. |
