| 摘要 |
A molded electrical interconnect having an electrical conductor embedded therein, a conductive terminal disposed in the cavity, a first end portion of the terminal disposed toward an open end of the cavity and a second end portion thereof coupled to a portion of the electrical conductor protruding into the cavity, the terminal is pivotally supported by a fulcrum near the second end portion thereof so that the first end portion of the terminal is movable in the cavity for alignment with a mating terminal.
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