ELECTRODE AND ITS MANUFACTURING METHOD, LEAD WIRING USING THE SAME AND ITS CONNECTING METHOD, AND ELECTRONIC PARTS AND ELECTRONIC APPARATUS USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an electrode which uses a film with a uniform thickness in particle size level wherein conductive particulates are selectively formed by one layer on the surface of an optional substrate, or an electrode which uses a film wherein a film having one layer of conductive particulates is selectively accumulated by plural layers, and to provide their manufacturing method and lead wiring using them and their connecting method. SOLUTION: The electrode is formed by covalent bonding of a film of conductive particulate that is selectively formed by one layer on the surface of a wiring end or a lead wire end with a first organic film 21 that is selectively formed on the surface of the wiring end, or at the lead wire end by means of a second organic film formed on the surface of the conductive particulate, and another electrode is provided with different organic films. COPYRIGHT: (C)2007,JPO&INPIT