WAFER LEVEL PACKAGE AND METHOD OF FABRICATING THE SAME

摘要

A wafer package and a manufacturing method thereof are provided to minimize reliability reduction of connectivity due to an excessive protrusion of a connection device by forming the connection device penetrating a floor of a trench, after forming the trench according to a scribe line. A plurality of semiconductor chips having a connection pad are formed on a wafer(S10). A trench is formed under the connection pad by patterning a bottom surface of the wafer(S30). A via hole exposing the bottom surface of the connection pad is formed by patterning the bottom surface of the trench(S50). A connection device is formed and connected to the connection pad through the via hole(S60).