| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed circuit board which is excellent in insulation, high in reliability, and suitable for high current use, by few manufacturing processes. SOLUTION: The manufacturing method of a printed circuit board 1 in which a circuit conductor 3 formed on an insulating substrate 2 is coated with a solder resist 8 includes a process to form the circuit conductor 3 thicker than a predetermined thickness on the insulating substrate 2 by etching a metal foil 4 adhered on the insulating substrate 2, and a process to form roundness in an etching portion 7 of the circuit conductor 3 by wet-etching the circuit conductor 3, wherein by wet-etching the circuit conductor 3, not only an edge portion 7 but also the surface of the circuit conductor 3 are scraped making it possible to round the edge portion 7. COPYRIGHT: (C)2008,JPO&INPIT
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