| 摘要 |
PROBLEM TO BE SOLVED: To further surely prevent short circuit caused by migration. SOLUTION: A groove 12 is provided to a wiring pattern formation position of a surface of an insulating base material 11. A conductor layer 13 is formed by applying a conductive member to a bottom part of the groove 12. A sealing member with humidity resistance is applied to the groove 12 wherein the conductor layer 13 is formed, and a protection layer 14 is formed not to project from the surface of the insulating base material 11. Since the conductor layer 13 is formed in the bottom part of the groove 12, a creeping distance between conductor layers is elongated, and since the protection layer 14 is also provided, short circuit between the conductor layers 13 due to migration is prevented. Furthermore, since the protection layer 14 is formed not to project from the surface of the insulating base material 11, the protection layer 14 is hardly damaged when compared to the case that it is formed to project, thus further surely preventing short circuit between the conductor layers 13 due to migration. COPYRIGHT: (C)2008,JPO&INPIT
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