| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip type electronic component-storing pasteboard which does not cause generation of fluff in the inside of many recesses formed on a paper base material for housing a chip component and causes no or little generation of fall off of the fluff when a cover tape covering the recesses is peeled. SOLUTION: A surface treatment agent having a viscosity adjusted at not larger than 10 m×Pa s, is applied on a surface of the paper base material at a fiber application amount of less than 1.1 g/m<SP>2</SP>, and is made to penetrates from the surface on the opening side of the recess of the paper base material to the depth of more than 50μm. The center line average surface roughness (Ra) of the surface of the paper base material is adjusted at 3μm or more. COPYRIGHT: (C)2008,JPO&INPIT
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