| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress an electrostatic capacity of a through-hole of a high density/highly-multilayered printed-circuit board for transmitting a high-speed signal. <P>SOLUTION: The through-hole for press fittig a press-fit pin is formed to the printed-circuit board of this invention. The printed-circuit board comprises at least one signal transmission layer, a wiring pattern for signal transmission formed to at least the one signal transmission layer, and an electrode part of the wiring pattern for signal transmission exposing on an inner circumferential surface of the through-hole. The electrode is formed not on the whole inner circumferential surface of the through-hole, but on only a part of it. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
