METHOD OF PICKING UP ELECTRONIC COMPONENT AND PICKUP DEVICE USED THEREFOR

摘要

PROBLEM TO BE SOLVED: To unfailingly peel an electronic component from an adhesive sheet after dicing by preventing crack or chipping caused in peeling the electronic component. SOLUTION: The pickup method for peeling an electronic component 5 stuck on an adhesive sheet 9 while using its one surface as an adhesive surface is provided with: a first step of expanding the adhesive sheet 9 by pressing the electronic component 5 on the adhesive surface from the adhesive sheet 9 side to push up the electronic component 5; and a second step of peeling off the electronic component 5 from the adhesive sheet 9 by pressing the end of the electronic component 5 on the adhesive surface from the adhesive sheet 9 side to peel the electronic component 5 from the adhesive sheet 9. The second step includes peeling the electronic component 5 from the adhesive sheet 9 by alternately pressing both the ends of the electronic component 5 on the adhesive surface. COPYRIGHT: (C)2008,JPO&INPIT