| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate by which when repair processing is carried out on a flexible substrate and a rigid substrate, both being connected through an adhesive, the released flexible substrate can be reused. SOLUTION: While the rigid substrate 1 and flexible substrate 3 bonded through the conductive adhesive 5 are heated to the glass transition temperature of thermosetting resin of the conductive adhesive 5 or higher, the flexible substrate 3 is peeled off in the length direction H of first and second electrodes 2 and 4 to release the flexible substrate 3 from the rigid substrate 1. COPYRIGHT: (C)2009,JPO&INPIT
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