发明名称 CONNECTION PADS FOR A FINGERPRINT SENSING DEVICE
摘要 A fingerprint sensing device comprising sensing circuitry comprising a plurality of sensing elements, each sensing element comprising a sensing structure arranged in a sensing plane and facing a surface of the capacitive fingerprint sensing device, each of the sensing elements being configured to provide a signal indicative of an electromagnetic coupling between the sensing structure and a finger placed on the surface of the fingerprint sensing device; and a plurality of connection pads electrically connected to the sensing circuitry for providing an electrical connection between the sensing circuitry and readout circuitry, wherein each of the connection pads is separately recessed in relation to the sensing plane such that each connection pad has a floor in a floor plane, and wherein each connection pad is separated from an adjacent connection pad through a portion of the sensing device being elevated in relation to the floor plane.
申请公布号 US2016210495(A1) 申请公布日期 2016.07.21
申请号 US201414911573 申请日期 2014.08.22
申请人 FINGERPRINT CARDS AB 发明人 JÄGEMALM Pontus;LUNDAHL Karl;SLOTTNER Mats;THÖRNBLOM Hans;JULIAN Ojie
分类号 G06K9/00;H01L23/00 主分类号 G06K9/00
代理机构 代理人
主权项 1. A fingerprint sensing device comprising: sensing circuitry comprising a plurality of sensing elements, each sensing element comprising a sensing structure arranged in a sensing plane and facing a surface of the capacitive fingerprint sensing device, each of said sensing elements being configured to provide a signal indicative of an electromagnetic coupling between said sensing structure and a finger placed on said surface of the fingerprint sensing device; and a plurality of connection pads electrically connected to said sensing circuitry for providing an electrical connection between said sensing circuitry and readout circuitry, wherein each of said connection pads is separately recessed in relation to the sensing plane such that each connection pad has a floor in a floor plane, and wherein each connection pad is separated from an adjacent connection pad through a portion of said sensing device being elevated in relation to said floor plane.
地址 Göteborg SE