发明名称 |
Structure and formation method of FinFET device |
摘要 |
Structures and formation methods of a semiconductor device are provided. The semiconductor device structure includes a semiconductor substrate and a fin structure over the semiconductor substrate. The semiconductor device structure also includes a gate stack covering a portion of the fin structure and a source/drain structure over the fin structure and adjacent to the gate stack. The semiconductor device structure further includes an isolation layer between the source/drain structure and the semiconductor substrate. |
申请公布号 |
US9412814(B2) |
申请公布日期 |
2016.08.09 |
申请号 |
US201414582975 |
申请日期 |
2014.12.24 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
Lee Tung-Ying;Huang Yu-Lien |
分类号 |
H01L27/088;H01L29/06;H01L29/66;H01L29/78;H01L29/161;H01L21/02;H01L27/11;H01L29/51 |
主分类号 |
H01L27/088 |
代理机构 |
Birch, Stewart, Kolasch & Birch, LLP |
代理人 |
Birch, Stewart, Kolasch & Birch, LLP |
主权项 |
1. A semiconductor device structure, comprising:
a semiconductor substrate; a fin structure over the semiconductor substrate; a gate stack covering a portion of the fin structure; a source/drain structure over the fin structure and adjacent to the gate stack; and an isolation layer between the source/drain structure and the semiconductor substrate, wherein the isolation layer is directly under the source/drain structure. |
地址 |
Hsin-Chu TW |