发明名称 Structure and formation method of FinFET device
摘要 Structures and formation methods of a semiconductor device are provided. The semiconductor device structure includes a semiconductor substrate and a fin structure over the semiconductor substrate. The semiconductor device structure also includes a gate stack covering a portion of the fin structure and a source/drain structure over the fin structure and adjacent to the gate stack. The semiconductor device structure further includes an isolation layer between the source/drain structure and the semiconductor substrate.
申请公布号 US9412814(B2) 申请公布日期 2016.08.09
申请号 US201414582975 申请日期 2014.12.24
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 Lee Tung-Ying;Huang Yu-Lien
分类号 H01L27/088;H01L29/06;H01L29/66;H01L29/78;H01L29/161;H01L21/02;H01L27/11;H01L29/51 主分类号 H01L27/088
代理机构 Birch, Stewart, Kolasch & Birch, LLP 代理人 Birch, Stewart, Kolasch & Birch, LLP
主权项 1. A semiconductor device structure, comprising: a semiconductor substrate; a fin structure over the semiconductor substrate; a gate stack covering a portion of the fin structure; a source/drain structure over the fin structure and adjacent to the gate stack; and an isolation layer between the source/drain structure and the semiconductor substrate, wherein the isolation layer is directly under the source/drain structure.
地址 Hsin-Chu TW