发明名称 MOUNTING DEVICE AND MOUNTING METHOD
摘要 In a mounting device 11, when a component 60 (second component) that is softer and/or more adhesive than a normal component (first component) is arranged on a substrate S, a suction nozzle 30 is detached from the component 60 due to movement parameters (speed, acceleration) which are greater than those for the first component. The component 60, which has high softness, adhesiveness, and the like, has properties whereby it is difficult to detach the component 60 from the suction nozzle 30, but if, when detaching from such a component 60, the movement speed or acceleration of the suction nozzle 30 is greatly increased, the inertial force of the component 60 is relatively increased, and the component 60 becomes more likely to remain in position.
申请公布号 WO2016129038(A1) 申请公布日期 2016.08.18
申请号 WO2015JP53528 申请日期 2015.02.09
申请人 FUJI MACHINE MFG. CO., LTD. 发明人 TSUCHIYA, Yusuke
分类号 H05K13/04 主分类号 H05K13/04
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