发明名称 SEMICONDUCTOR DEVICE
摘要 A semiconductor device according to an embodiment includes a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type in contact with the first semiconductor region, a third semiconductor region of the first conductivity type in contact with the second semiconductor region and spaced from the first semiconductor region, a first insulating film provided between the first semiconductor region and the third semiconductor region on the second semiconductor region, a first electrode provided on the first insulating film, a high-pass filter connected between the first semiconductor region and the third semiconductor region, and a low-pass filter connected between the second semiconductor region and the third semiconductor region.
申请公布号 US2016260705(A1) 申请公布日期 2016.09.08
申请号 US201514828802 申请日期 2015.08.18
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 IKIMURA Takehito
分类号 H01L27/06;H01L23/522;H01L27/02;H01L29/10;H01L29/36;H01L29/78;H01L29/06 主分类号 H01L27/06
代理机构 代理人
主权项 1. A semiconductor device comprising: a first semiconductor region of a first conductivity type; a second semiconductor region of a second conductivity type in contact with the first semiconductor region; a third semiconductor region of the first conductivity type in contact with the second semiconductor region and spaced from the first semiconductor region; a first insulating film provided between the first semiconductor region and the third semiconductor region on the second semiconductor region; a first electrode provided on the first insulating film; a high-pass filter connected between the first semiconductor region and the third semiconductor region; and a low-pass filter connected between the second semiconductor region and the third semiconductor region.
地址 Tokyo JP