SHEET FOR FORMING RESIN FILM AND COMPOSITE SHEET FOR FORMING RESIN FILM

摘要

The present invention provides: a sheet for forming a resin film, which has excellent reworkability and is bonded to a silicon wafer to form a resin film on the silicon wafer, and wherein a surface (α) of the sheet, said surface being bonded to the silicon wafer, has a surface roughness (Ra) of 40 nm or more; and a composite sheet for forming a resin film, which has a configuration wherein the sheet for forming a resin film and a supporting body are directly laminated.