| 发明名称 |
LEAD-FRAME |
| 摘要 |
One example discloses a lead-frame, comprising: a die-pad having a die coupling surface; a set of terminals each having an outer terminal edge and an inner terminal edge; wherein the outer terminal edge faces away from the die-pad and the inner terminal edge faces toward the die-pad; and a terminal connector having a first side coupled to the inner terminal edge and a second side coupled to the die-pad. |
| 申请公布号 |
US2016307825(A1) |
申请公布日期 |
2016.10.20 |
| 申请号 |
US201514691100 |
申请日期 |
2015.04.20 |
| 申请人 |
NXP B.V. |
发明人 |
Offeringa Pieter |
| 分类号 |
H01L23/495;H01L21/48;H01L21/3205;H01L21/56 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A lead-frame, comprising:
a die-pad having a die coupling surface; a set of terminals each having an outer terminal edge and an inner terminal edge; wherein the outer terminal edge faces away from the die-pad and the inner terminal edge faces toward the die-pad; and a terminal connector having a first side coupled to the inner terminal edge and a second side coupled to the die-pad. |
| 地址 |
Eindhoven NL |
