| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency circuit board which ensures high adhesion of a thermoplastic liquid crystal polymer and a metal foil circuit, while reducing transmission loss of electric signal in high frequency application.SOLUTION: A high frequency circuit board consists of a laminate formed by laminating a thermoplastic liquid crystal polymer film on a metal foil having an irregular surface, where the surface roughness (Rz) is in a range of 0.5-5 μm, and the ratio (Rz/Sm) of the surface roughness (Rz) and the interval (Sm) of surface irregularities is in a range of 1.5-2.5 (excepting Sm of 2 μm or more). Transmission loss at 40 GHz is less than -0.35db/cm at 40 GHz, and bond strength between the metal foil and the thermoplastic liquid crystal polymer film is 0.5 kgf or more. |
