Appts. for electroplating copper@ plating flat, plate or arcuate components - has voltage source including at least one adjustable rectangular pulse generator

摘要

The appts. for electroplating, esp. copper plating flat, plate or arcuate components (esp. printed circuit boards), comprises a machine housing with electrolyte, a transport system for horizontal transport of the components, at least one anode parallel to the component transport direction, an electrical contact device for the components, and a voltage source. The voltage source includes at least one rectangular pulse generator whose output with adjustable parameters is fed to the anodes or the contact device, with the time-average potential of the anodes relative to the contact device being kept positive. USE/ADVANTAGE - For plating flat, plate or arcuate components. Plating rates are increased. Shorter plating installations are feasible.