| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a lead frame pair mounting a semiconductor chip having small area and low inductance or resistance at the joint to the lead frame. SOLUTION: A first lead frame 10 is provided with a rail 11, a die pad 14 mounting a semiconductor chip 60, and a suspension pin 16 connecting the die pad and rail. A second lead frame 20 is provided with a rail 21 and a lead 22. The lead frames 10, 20 are provided, at corresponding positions, with alignment holes 15, 25 which is utilized, along with the pin, for superposing an electrode 22a at the forward end of the lead 22 in the second lead frame 20 on a metal electrode part 61 of a semiconductor chip 60 before bonding them by heating under pressure.</p> |
