发明名称 DEVICE FOR MANUFACTURING SEMICONDUCTOR
摘要 <p>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing device for simplifying the change work of the processing method of a substrate, preventing malfunction of a transfer machine resulted from the input of an erroneous movement parameter or V shaft position data, and to improve productivity. SOLUTION: At the time of changing the processing method of a substrate, only one of substrate arrangement parameters stored in a memory card 23 of an operating part 11 is selected, so that a movement parameter and V shaft position data corresponding to the pitch identification data of the substrate arrangement parameter can be read automatically from an RAM 17 by a CPU 15. The CPU 15 operates a transfer machine 6 based on the substrate arrangement parameter, the movement parameter, and the V shaft position data. Therefore, at the time of changing the processing method of the substrate, it is not necessary to newly re-input the movement parameters and the V shaft position data to the RAM 17.</p>
申请公布号 JPH1131733(A) 申请公布日期 1999.02.02
申请号 JP19970200894 申请日期 1997.07.10
申请人 KOKUSAI ELECTRIC CO LTD 发明人 SEKIHARA HITOSHI;KIYOKU MASATOSHI
分类号 H01L21/677;H01L21/22;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/677
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