| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip thermocompression bonding tool wherein parallel state of indenters is prevented from changing as time lapses under effect of repetition of heating and cooling, etc. SOLUTION: A ceramics holder 2 comprising a plurality of cooling slits 18 is attached to a lower end of a metal connection block 30 attached to a lower end of a metal tool main body 1, while the ceramics holder 2, a ceramics heater 4, and a ceramics indenter 5 are sintered. The ceramics holder 2 may be directly attached to the lower end of the metal tool main body 1, with no connection block 30 attached. First and second air blow channels 19 and 24 and chip sucking hole 13, etc., are recommended to be provided. |
