发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME. |
摘要 |
A semiconductor device includes a board and a semiconductor chip which is connected to an upper surface of the board via face-down bonding. The semiconductor device further includes a frame-shape member which is connected to the upper surface of the board with first adhesive, and has an opening to accommodate the semiconductor chip therein, and a plate-shape member which is situated to cover the semiconductor chip and the frame-shape member, and is connected to the semiconductor chip and the frame-shape member with second adhesive, wherein the frame-shape member has such a sufficient sturdiness as to prevent thermal-expansion-induced deformations of the board and the plate-shape member.
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申请公布号 |
US2002001178(A1) |
申请公布日期 |
2002.01.03 |
申请号 |
US19980185716 |
申请日期 |
1998.11.04 |
申请人 |
IIJIMA MAKOTO;WAKABAYASHI TETSUSHI;HAMANO TOSHIO;MINAMIZAWA MASAHARU;TAKENAKA MASASHI;YAMASHITA TATUROU;MIZUKOSHI MASATAKA;NUKIWA MASARU;AKAI TAKAO |
发明人 |
IIJIMA MAKOTO;WAKABAYASHI TETSUSHI;HAMANO TOSHIO;MINAMIZAWA MASAHARU;TAKENAKA MASASHI;YAMASHITA TATUROU;MIZUKOSHI MASATAKA;NUKIWA MASARU;AKAI TAKAO |
分类号 |
H01L23/10;H01L23/31;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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