| 发明名称 |
ACCELEROMETER PROTECTED BY CAPS APPLIED AT THE WAFER SCALE |
| 摘要 |
<p>An accelerometer chip (202) has a molded thermoplastic cap (210) applied on one surface to provide a cavity into which the cantilevered mass (204) of the accelerometer may move. An array of caps is applied to a wafer of accelerometer chips (202) before singulation of the wafer.</p> |
| 申请公布号 |
WO02056031(A1) |
申请公布日期 |
2002.07.18 |
| 申请号 |
WO2002AU00013 |
申请日期 |
2002.01.08 |
| 申请人 |
SILVERBROOK RESEARCH PTY. LTD.;SILVERBROOK, KIA |
发明人 |
SILVERBROOK, KIA |
| 分类号 |
B29C35/08;B29C43/36;B81B7/00;B81C1/00;G01P1/02;G01P15/08;H01L23/02;H01L23/08;H01L23/16;H01L23/31;(IPC1-7):G01P15/08;H01L23/04;H01L21/822 |
主分类号 |
B29C35/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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