发明名称 APPARATUS AND METHOD OF MOUNTING ELECTRONIC PART
摘要 <P>PROBLEM TO BE SOLVED: To improve the mounting quality of an electronic part by detecting the front surface height of a substrate in high accuracy in the state that the substrate is installed on an XY table. <P>SOLUTION: The apparatus of mounting the electronic part which mounts the electronic part on the substrate positioned on the XY table by lowering a nozzle for holding the electronic part includes a control means for determining the amount of declining of the nozzle based on the detected values of a plurality of sensors for continuously detecting the surface heights of the substrate continuously without contact. The plurality of the sensors are arranged and provided adjustably at an interval in one direction, and configured to be provided so that the relative displacement might become possible to the substrate in the direction different from the arrangement direction. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006228793(A) 申请公布日期 2006.08.31
申请号 JP20050037510 申请日期 2005.02.15
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 SHIBATA NOBUO;WATANABE HIROYUKI;KATO AKIRA;IIDA SHIGERU;ONISHI SEIJI
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
主权项
地址