| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inexpensive, small, and highly reliable leadless package type electronic part, electronic part raw material for manufacturing the electronic part and a method of manufacturing the same. <P>SOLUTION: A leadless package type electronic part has a square substrate 6 provided with a plurality of external electrodes 7 in circumference, an element component 1 mounted on the surface of the substrate 6 under the condition of being electrically connected with the outer electrodes 7, and mold resin 5, with which the element component 1 is molded on the surface of the substrate 6. The surface of the mold resin 5 is flatly formed, and each side surface of the mold resin 5 is formed to be flush with the substrate 6. <P>COPYRIGHT: (C)2007,JPO&INPIT |
