| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of mounting an electronic component by which the degradation of strength due caused by Kirkendall voids can be prevented when mounting an electronic component for solder-bonding a gold bump. <P>SOLUTION: The method of manufacturing an electronic component is used to bond a gold bump 5 formed on an electronic part 6 to an electrode 2 by using tin or tin-based solder, and to adhere the electronic part 6 and a substrate 1 by a thermosetting resin 3. In a bump bonding step for bonding the gold bump 5 to the electrode 2 while heating the electronic part 6, the thermosetting resin 3 is allowed to flow outward by the lower side of the electronic part 6, and solder particles 4 are brought into contact with the side of the gold bump 5 that is heated higher than the melting point of the solder. At the same time, a part of the solder particles 4 is melted while it is being pinched between the gold bump 5 and the electrode 2. Thus, the dispersion of Sn from the gold bump 5 to the outside is promoted to increase the concentration of Sn in the gold bump 5. Therefore, the dispersion of Sn from the solder bonding part to the gold bump 5 can suppress Kirkendall voids. <P>COPYRIGHT: (C)2007,JPO&INPIT |
