| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board which can prevent the disconnection of an outermost conductor wiring that is caused by concentrated stress generating when a projection electrode and an electrode pad of a semiconductor element are bonded with each other. <P>SOLUTION: The wiring board is provided with a flexible insulating substrate, a plurality of conductor wirings 2 arranged in line on the flexible insulating substrate, and a projection electrode 3 which is located at ends in an area wherein semiconductor elements 4 of the respective conductor wirings are mounted. It is also provided with an auxiliary conductor wiring 11 which is adjacent to the outside of an outermost conductor wiring 10 and is located at the outermost corner in an area wherein the semiconductor is mounted and an auxiliary projection electrode 12 which is formed on the auxiliary conductor wiring in line with the projection electrode on the conductor wiring. In the auxiliary conductor wiring, its terminal is formed adjacent to the auxiliary projection electrode in the outside direction of the semiconductor element mounting area from the auxiliary projection electrode, and the terminal is bent adjacent to the auxiliary projection electrode in the outside and inside direction of the semiconductor element mounting area from the auxiliary projection electrode, and the terminal is connected with the tip end of the adjacent outermost conductor wiring. <P>COPYRIGHT: (C)2007,JPO&INPIT |
