SEMICONDUCTOR CHIP WITH AMORPHOUS CRACK-STOP LAYER

摘要

A semiconductor chip (19; 20; 21; 22) comprises a crystalline layer (31; 32; 32'; 32'') of semiconductor material having an active surface (27; 28; 28'; 28'') and a passive surface (29; 30; 30'; 30''). The active surface (27; 28; 28'; 28'') com-prises embedded electrical circuits and contact regions (23; 24; 24'; 24'') for contacting the electrical circuits. One or more amorphous layers (25; 26; 26'; 26'') of semiconductor material or of semiconductor oxide material are provided on the passive surface (29; 30; 30'; 30'').