THERMOSETTING COMPOSITION FOR ORGANIC EL DEVICE SEALING

摘要

[PROBLEMS] To provide a thermosetting composition for organic EL device sealing that attains sealing without detriment to the organic EL device so that the occurrence/growth of dark spots is surely inhibited with high transmittance retained to thereby maintain stable emission performance over a prolonged period of time. [MEANS FOR SOLVING PROBLEMS] Sealing of organic EL device is carried out by the use of a composition comprising as main components 100 pts.wt. of low-molecular-weight epoxy resin of 200 to 2000 molecular weight (A) having at least two glycidyl groups per molecule; 40 to 150 pts.wt. of high-molecular-weight epoxy resin of 20,000 to 100,000 molecular weight (B) having a bisphenol A or bisphenol F skeleton; per 100 pts.wt. of the sum of component (A) and component (B), 0.5 to 20 pts.wt. of latent imidazole compound (C) having a nitrile group; and 0.1 to 10 pts.wt. of silane coupling agent (D).