| 摘要 |
A multi-chip package and method is disclosed. In one embodiment, the multi-chip package includes at least four of spaced semiconductor integrated circuit chips mounted on a printed circuit board, consisting of the first pair of the semiconductor integrated circuit chips and the second pair of the semiconductor integrated circuit chips. The chips of the first pair of the semiconductor integrated circuit chips are arranged substantially parallel and the chips of the semiconductor integrated circuit chips of the second pair are arranged substantially stacked over the chips of the first pair of the semiconductor integrated circuit chips. |
