| 摘要 |
A method for forming metal wiring and a method for manufacturing an active matrix substrate are provided to form a conductive layer by starting the heating of a coated solution including fine metal particles and a dispersion stabilizer within a predetermined time after coating the solution on the underlayer, thereby improving the degree of contact of a conductive layer. A method for forming metal wiring comprises the following steps of: forming an underlayer(F1) on a substrate; coating a solution including fine metal particles and a dispersion stabilizer on the underlayer; and heating the coated solution to form a conductive layer(F2). After coating the solution on the underlayer, the conductive layer is formed by starting the heating of the coated solution within a predetermined time. |
