| 摘要 |
A compact power semiconductor module having a connection apparatus is provided to easily arrange a load terminal and a control terminal on a PCB by including a connection apparatus of a film complex type. A power semiconductor module includes a housing(3), at least a substrate having a conductive track and power semiconductor elements disposed on the conductive track by a proper method for a circuit, and a connection apparatus. The connection apparatus includes first and second conductive layers that are respectively patterned to form a conductive track and a film complex including an insulation layer(62) disposed between the first and the second layers. The first conductive layer includes a first contact part with respect to a power connection region of the power semiconductor elements formed by a spot-welded joint type, a second contact part with respect to a control connection region of the power semiconductor element, and a third contact part(604) for a load connection part with respect to a PCB. The second conductive layer includes a connection part with a fourth contact part(606) for a control connection part with respect to the first conductive layer and the PCB wherein the connection part is proper for a circuit. The film complex includes a film part disposed in a guide part of the housing wherein the film part is positioned between the first and the second contact parts and between the third and the fourth contact parts. The third and fourth contact parts have a parallel area normal. |
