| 摘要 |
A trap for semiconductor fabrication equipment is provided to collect rapidly byproducts of discharged gas by heating and cooling the byproducts. A first housing(110) includes a gas inlet(112) connected to a process chamber, an internal space, and a gas outlet for discharging gas. A plurality of first baffle plates are formed within the first housing. A heater comes in contact with the first baffle plate in order to heat the first baffle plate. A second housing(160) includes a gas inlet(162) connected to the gas outlet of the first housing, an internal space, and a gas outlet connected to the pump. A plurality of second baffle plates are formed within the second housing and include a hole. A cooling unit comes in contact with the second baffle plate in order to cool the second baffle plate. An arrangement interval of the first baffle plate is getting reduced toward a backside of a gas flow path.
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