| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a copper film, by which a homogeneous copper thin film can be formed on the surface of a substrate by using stable and easily handlable copper formate. SOLUTION: The method for forming the copper film is characterized by: placing a substrate heated to a prescribed temperature in an atmosphere of an inert gas inactive at the heating temperature; spraying a copper formate solution obtained by dissolving copper formate into a solvent evaporating at the heating temperature, toward the surface of the substrate; and evaporating the solvent in the copper formate solution sprayed at the heating temperature and thermally decomposing the copper formate without using a catalyst to form a copper thin film on a prescribed surface of the substrate. COPYRIGHT: (C)2009,JPO&INPIT
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