| 摘要 |
A thermally conductive ball grid array (BGA) package for integrated circuits having improved ground path employs a printed circuit substrate. The substrate has an array of solder balls disposed on the bottom side. There is an opening in the substrate corresponding to the integrated circuit die. A grounding ring covers the vertical walls of the opening and includes an upper ground collar on the top side of the substrate and a lower ground collar on the bottom side of the substrate. A thermally and electrically conductive heat spreader is attached to the lower ground collar on the bottom side of the BGA package, covering the opening in the substrate. The integrated circuit die is mounted on the heat spreader, with the active side up, within the opening in the substrate. Ground pads on the active side of the die are attached to the upper ground collar by wire bonds, to provide a continuous ground path from the ground pads to the heat spreader. Molded plastic covers the semiconductor device and the top side of the substrate.
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